发明名称 |
Self-Contained Cooling Mechanism for Integrated Circuit Using a Reversible Endothermic Chemical Reaction |
摘要 |
A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a working fluid including a chemical compound that reacts endothermically to absorb heat produced by the devices and releases the heat in a reverse reaction to the enclosure.
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申请公布号 |
US2008258295(A1) |
申请公布日期 |
2008.10.23 |
申请号 |
US20060816674 |
申请日期 |
2006.02.21 |
申请人 |
WILKINS WENDY L;GILBERT BARRY K |
发明人 |
WILKINS WENDY L.;GILBERT BARRY K. |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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