| 发明名称 |
Film, Silica Film and Method of Forming the Same, Composition for Forming Silica Film, and Electronic Part |
| 摘要 |
The coating film of the invention is obtained by curing an applied film formed by application of a composition containing an organic solvent with a boiling point of 80° C. or higher, wherein the shrinkage ratio of the film thickness from the applied film immediately after application is no greater than 27%.
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| 申请公布号 |
US2008260956(A1) |
申请公布日期 |
2008.10.23 |
| 申请号 |
US20050793593 |
申请日期 |
2005.12.21 |
| 申请人 |
SAKURAI HARUAKI;YOSHIKAWA TAKAHIRO |
发明人 |
SAKURAI HARUAKI;YOSHIKAWA TAKAHIRO |
| 分类号 |
B05D3/02;C09D183/04 |
主分类号 |
B05D3/02 |
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