POLISHING PAD

摘要

Disclosed is a polishing pad which is capable of maintaining high dimensional stability when it absorbs moisture or water, while having high polishing rate. Also disclosed are a method for producing such a polishing pad and a method for manufacturing a semiconductor device using such a polishing pad. Specifically disclosed is a polishing pad comprising a polishing layer which is composed of a polyurethane foam having fine air bubbles. This polishing pad is characterized in that the polyurethane foam contains a cured body obtained by reaction among (1) a prepolymer A having a terminal isocyanate group, which contains an isocyanate monomer, a high-molecular-weight polyol a and a low-molecular-weight polyol, (2) a prepolymer B having a terminal isocyanate group, which contains a polymerized diisocyanate and a polyethylene glycol having a number average molecular weight of 200-1,000 and (3) a chain extender.