| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of forming bumps in a self-assembly manner with superior productivity. <P>SOLUTION: The method forms a bump 19 on an electrode 32 of a wiring board 31, and a paste used for the same is provided. After a fluid body 20 containing conductive particles are supplied onto a region of the wiring board 31 which includes the electrode 32, a plate type member 40 is disposed on the wiring board 31 with the fluid body 20 interposed. Then air bubble 30 is generated in the fluid body 20 by heating the fluid body 20. Then the fluid body 20 contains a defoaming agent eliminating the air bubble 30 by reducing the surface tension of the fluid body 20. <P>COPYRIGHT: (C)2009,JPO&INPIT |
