发明名称 DEVICE FOR FORMING CONDUCTIVE PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a process layout minimizing the pollution of a pattern or the inside of a device due to the back flow or liquid leakage of a liquid material such as a developer and a washing liquid in the device for forming a conductive pattern, and to provide the device for forming the conductive pattern by the process layout. <P>SOLUTION: A developing/washing device in the device for forming the conductive pattern by an electrophotographic system is arranged in a region lower than the center of a photosensitive body. A solvent removing process is arranged in the region rotating the photosensitive body in the ascending direction. A transfer-liquid coating/electrostatic-transfer process is fitted in the region being upper than the center of the photosensitive body and rotating the photosensitive body in the descending direction. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008258290(A) 申请公布日期 2008.10.23
申请号 JP20070096989 申请日期 2007.04.03
申请人 HITACHI LTD 发明人 SANO YUICHIRO;MIYASAKA TORU
分类号 H05K3/12 主分类号 H05K3/12
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