发明名称 FLEXIBLE SUBSTRATE, ELECTRONIC EQUIPMENT, AND METHOD OF CONNECTING ELECTRONIC EQUIPMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To prevent a flexible substrate from enlargement of width according to the increase of the number of wirings. <P>SOLUTION: The flexible substrate is a substrate for connecting the wiring of a first housing portion and the wiring of a second housing portion in an electronic equipment including the first housing portion and the second housing portion. The flexible substrate includes a first housing side connection member to be connected to the first housing portion and a plurality of second housing connection members to be connected to the second housing portion. The flexible substrate includes a first bending portion for folding the flexible substrate, and a second bending portion different from the first bending portion. The first housing member and the second housing member is connected at the first bending portion and the second bending portion of the flexible substrate while both the first bending portion and the second bending portion are bent. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008258644(A) 申请公布日期 2008.10.23
申请号 JP20080133379 申请日期 2008.05.21
申请人 NEC SAITAMA LTD 发明人 OKONOGI ISAO;NAGATA DAIGO
分类号 H05K7/14;H04M1/02 主分类号 H05K7/14
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