| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive silicone compound-containing resin composition which is suitable for use as a buffer coat material and a rewiring layer material of an LSI chip, ensures a small film thickness reduction before and after curing, has such a low dielectric constant as ≤2.7 and a viscosity suitable for film formation, and can be cured in the air even if a normal photopolymerization initiator is used, and a resin insulating film using the same. <P>SOLUTION: The photosensitive resin composition contains 100 pts.mass of a photosensitive silicone compound having a specific structure and 0.1-20 pts.mass of a photopolymerization initiator. <P>COPYRIGHT: (C)2009,JPO&INPIT |
