| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for increasing a mounting density while reducing noise in a semiconductor device. SOLUTION: An LSI 102 mounted on a printed wiring board 101 has a BGA ball 105b for grounding and a BGA ball 105a for power supply, both of which are for receiving power from the printed wiring board 101. The BGA ball 105b for grounding and the BGA ball 105a for power supply are adjacent to each other. The printed wiring board 101 is mounted with a decoupling capacitor 103, which has a terminal 113 and a terminal 114. The BGA ball 105b for grounding and the terminal 113 are connected by a metal electrode flat plate 110, while the BGA ball 105a for power supply and the terminal 114 are connected by a metal electrode flat plate 111. Between the metal electrode flat plate 110 and the metal electrode flat plate 111, a dielectric film 112 having a thickness of 1μm or less is interposed. COPYRIGHT: (C)2009,JPO&INPIT |
