| 摘要 |
PROBLEM TO BE SOLVED: To provide a curing promoter capable of expressing high fluidity, to provide an epoxy resin composition containing the same, and to provide an electronic part device equipped with elements sealed with the epoxy resin composition. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent and (C) the curing promoter. In the epoxy resin composition, the curing promoter C consists of (D) a modified resin prepared by reaction among (a) a phosphine compound, (b) a quinone compound and (c) a phenolic compound having, in one molecule, two or more, on average, of phenolic hydroxy groups, including 50 wt.% or more of a phenolic compound having, in the molecule, two phenolic hydroxy groups. COPYRIGHT: (C)2009,JPO&INPIT
|
