发明名称 Physical Vapor Deposition System
摘要 A physical vapor deposition system for making microparticles generated by using a non-transfer type plasma torch not generating an outgas even in an ultra-high vacuum environment accelerate by a supersonic gas flow and depositing microparticles on a substrate to form a coating film is provided. Provision is made of an evaporation chamber ( 10, 20 ) having a plasma torch ( 16, 26 ) and an evaporation source ( 15, 25 ) inside it and a film formation chamber 30 having a supersonic nozzle 35 and a substrate for film formation 33 . Each plasma torch has a substantially cylindrical electrically conductive anode 40 , a polymer-based or non-polymer-based insulation pipe 50 inserted to the inner side of that and generating less outgas than a Bakelite, and a rod shaped cathode 60 inserted to the inner side of an insulation pipe 50 . Microparticles are generated from an evaporation source ( 15, 25 ) by a plasma obtained by applying voltages to the anode 40 and the cathode 60 , ejected from a supersonic nozzle 35 , made to ride on a supersonic gas flow, and deposited by physical vapor deposition onto a substrate for film formation 33.
申请公布号 US2008257723(A1) 申请公布日期 2008.10.23
申请号 US20050577305 申请日期 2005.10.14
申请人 TAMA-TLO,LTD. 发明人 YUMOTO ATSUSHI;NIWA NAOTAKE;HIROKI FUJIO;SHIOTA ICHIRO;YAMAMOTO TAKAHISA
分类号 C23C14/34 主分类号 C23C14/34
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