| 摘要 |
Disclosed herewith is a semiconductor device capable of suppressing the peeling-off that might occur between an island and a resin layer due to a difference of the shrinkage between those items, thereby the reliability of the semiconductor device is improved. The semiconductor device of the present invention includes an island, a semiconductor chip mounted on the island, and a resin layer that seals the island and the semiconductor chip respectively. And at the interface between the island and the resin layer is provided a buffer film having an elastic modulus lower than that of the resin layer.
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