发明名称 |
EPOXY RESIN COMPOSITION, PREPREG, LAMINATE, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR DEVICE, INSULATING RESIN SHEET, AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD |
摘要 |
Disclosed is an epoxy resin composition essentially containing (A) an epoxy resin having a structure represented by the general formula (1) below, (B) a curing agent, (C) an inorganic filler, and (D) a cyanate resin and/or a prepolymer thereof. [chemical formula 1] (1) (In the formula, Ar represents a fused-ring aromatic hydrocarbon group; r represents an integer not less than 1; X represents a hydrogen or an epoxy group (a glycidyl ether group); R<SUB>1</SUB> represents one group selected from the group consisting of a hydrogen, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group; n represents an integer not less than 1; and p and q each represents an integer not less than 1, and p's and q's in respective repeating units may be the same as or different from one another.) |
申请公布号 |
WO2008126411(A1) |
申请公布日期 |
2008.10.23 |
申请号 |
WO2008JP00914 |
申请日期 |
2008.04.09 |
申请人 |
SUMITOMO BAKELITE CO., LTD.;ENDO, TADASUKE;TAKAHASHI, AKIHITO |
发明人 |
ENDO, TADASUKE;TAKAHASHI, AKIHITO |
分类号 |
C08G59/20;B32B27/38 |
主分类号 |
C08G59/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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