<p>Provided is a polishing pad which does not generate an end point detection error from the initial stage to the last stage of use due to deterioration of light transmittance. A method for manufacturing a semiconductor device using such polishing pad is also provided. The polishing pad is provided with a polishing layer which includes a polishing region and a light transmitting region. The surface of the light transmitting region on the side of the polishing surface is roughened, and the light transmitting region has a light transmittance of 40-60% for a wavelength of 600nm before use.</p>
