| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad used in forming a plain surface in a semi-conductor, an electric inducing/metal composite, an integrated circuit, etc. <P>SOLUTION: A method for laminating a polishing pad material by a laminator is characterized in laminating while static electricity is eliminated by an ionizer under such surroundings that a number of fine particles having a diameter of 0.3 μm or less is 10,200/m<SP>3</SP>or less. <P>COPYRIGHT: (C)2009,JPO&INPIT |
