| 摘要 |
<P>PROBLEM TO BE SOLVED: To connect a chip conductor to a package conductor without wire bonding. <P>SOLUTION: A substrate (chip) 320 is bonded on the surface of a package 310. A sealing member is printed on the surface of the package 310 and a substrate 320, a conductive member is printed over a formed sealing layer 350, a sealing member is printed over a formed wire layer 360, and some layers including a forming sealing layer 370 are cured occasionally or collectively. A semiconductor device 300 can be manufactured through these steps described above. A space between a package-side connecting pad 340 and a substrate-side connecting pad 330 is connected with the wire layer 360. The space between the wire layer 360 and the surface of the package 310 and the substrate 320 is electrically insulated with the sealing layer 350 of a predetermined thickness extending along the surface of the package 310 and the substrate 320. The pattern of a stratified wire formed in the wire layer 360 can be set more softly than the wire bonding. <P>COPYRIGHT: (C)2009,JPO&INPIT |
