| 摘要 |
PROBLEM TO BE SOLVED: To provide thermally conductive adhesives that can improve thermal conductivity without degrading adhesivity and insulation and can be also used appropriately to connect a semiconductor device and a heat dissipating member, and to provide a heat radiation module using the same and a power converter. SOLUTION: The thermally conductive adhesives is used to connect a semiconductor device and a heat dissipating member directly or by means of other members. It contains an insulation resin, aluminum nitride particles of 15 to 30μm in average particle size and nearly spherical alumina particles of 0.5 to 2μm in average particle size, and the mixing ratio (volume ratio) of the aluminum nitride particles and the nearly spherical alumina particles is 70:30-80:20. In addition, the total volume of them is 60-70 vol% of that of the insulation resin, the aluminum nitride particles and the alumina particles. COPYRIGHT: (C)2009,JPO&INPIT |
