发明名称 |
LEADFRAME FOR LEADLESS PACKAGE, STRUCTURE AND MANUFACTURING METHOD USING THE SAME |
摘要 |
A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered to the surfaces of the plurality of package units and fixes the die pad and the plurality of pins.
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申请公布号 |
US2008258279(A1) |
申请公布日期 |
2008.10.23 |
申请号 |
US20070934287 |
申请日期 |
2007.11.02 |
申请人 |
CHIPMOS TECHNOLOGIES INC. |
发明人 |
LIN CHUN YING;SHEN GENG SHIN;PAN YU TANG;CHOU SHIH WEN |
分类号 |
H01L23/495;H01L21/56 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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