| 摘要 |
<P>PROBLEM TO BE SOLVED: To simplify a manufacturing process, in which electrical connection to a semiconductor chip from an upper plane and a lower plane is possible. <P>SOLUTION: The semiconductor device and its manufacturing method includes a first semiconductor chip 10 on the upper plane of which a pad electrode 12 is formed, a resin portion 40 to seal the semiconductor chip 10 so as to cover the upper plane and the side plane of the first semiconductor chip 10 and to expose the lower plane, a columnar electrode 30 which communicates between the upper plane and the lower plane of the resin portion 40, of which the upper plane and the lower plane are exposed from the resin portion 40 with at least a part of the side plane being covered, and a bonding wire 32 which connects a pad electrode and the columnar electrode 30, of which a part is embedded in the columnar electrode 30 so that the one end is exposed from the lower plane of the columnar electrode 30 with the rest being covered by the resin portion 40. <P>COPYRIGHT: (C)2009,JPO&INPIT |
