发明名称 COVER FOR ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a cover for an electronic device which is easily assembled, has long service life and less power consumption, and to provide a manufacturing method thereof. <P>SOLUTION: The cover has a structure in which a plastic cover and a display device are integrally formed by injection molding, and the display device is an electronic ink display device. The manufacturing method includes a step of providing an injection molding die in which a first molding portion is formed on the substantial center of a female die, a second molding portion is formed on a male die and a concave portion is formed on the second molding portion; a step of providing the electronic ink display device having the same shape and size as those of the concave portion; a step of mounting the electronic ink display device into the concave portion of the male die; a step of forming a cavity to manufacture the plastic cover by mating the female die with the male die; a step of injecting a thermoplastic resin material into the cavity to form the plastic cover to be formed integrally with the display device; and a step of releasing the molding die to take out the cover for an electronic device after the plastic cover has been cured. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008258573(A) 申请公布日期 2008.10.23
申请号 JP20080001462 申请日期 2008.01.08
申请人 SUTECH TRADING LTD 发明人 KYO TETSUGEN;HANSEN KEN-HOLM
分类号 H05K5/03 主分类号 H05K5/03
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