PARAMETER ADJUSTING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND PROGRAM

摘要

PROBLEM TO BE SOLVED: To automatically calculate a parameter capable of minimizing the difference of a finish shape on a wafer when the production of products is developed in a plurality of manufacturing devices. SOLUTION: The finish shape FSr by the manufacturing device to be a reference and the finish shape FSn by the other manufacturing device to be an adjustment object are calculated using the same photomask, an adjustment object parameter PMn is changed until the difference amount becomes equal to or less than a prescribed value, and the difference amount is repeatedly calculated. The adjustment object parameter PMn when the difference amount becomes equal to or less than the prescribed value is stipulated as the parameter of the adjustment object manufacturing device. COPYRIGHT: (C)2009,JPO&INPIT