发明名称 Semiconductor Device and Method of Fabricating the Same
摘要 Disclosed is a semiconductor device. The semiconductor device includes a first type nitride-based cladding layer formed on a growth substrate having an insulating property, a multi quantum well nitride-based active layer formed on the first type nitride-based cladding layer and a second type nitride-based cladding layer, which is different from the first type nitride-based cladding layer and is formed on the multi quantum well nitride-based active layer. A tunnel junction layer is formed between the undoped buffering nitride-based layer and the first type nitride-based cladding layer or/and formed on the second type nitride-based cladding layer.
申请公布号 US2008258133(A1) 申请公布日期 2008.10.23
申请号 US20060092017 申请日期 2006.10.27
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SEONG TAE-YEON
分类号 H01L31/20;H01L29/12;H01L33/06;H01L33/12;H01L33/14;H01L33/32;H01L33/42 主分类号 H01L31/20
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