发明名称 METAL CORE CIRCUIT BOARDS FOR LIGHT EMITTING DIODE APPLICATIONS AND METHODS OF MANUFACTURE THEREOF
摘要 A insulated metal substrate laminate includes a metal substrate, a dielectric layer disposed upon the metal substrate, wherein the dielectric layer has an aperture formed therein and a thickness of less than or equal to 1 mil, and an electrically conductive layer disposed upon the dielectric layer, wherein the electrically conductive layer has an aperture formed therein, wherein the aperture is coaxially aligned over the aperture of the dielectric layer.
申请公布号 WO2008128016(A2) 申请公布日期 2008.10.23
申请号 WO2008US59983 申请日期 2008.04.11
申请人 WORLD PROPERTIES INC.;CHUN, SEUNG, B.;WHITE, MICHAEL, S. 发明人 CHUN, SEUNG, B.;WHITE, MICHAEL, S.
分类号 H05K1/02 主分类号 H05K1/02
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