ACOUSTIC STACK FOR ULTRASONIC TRANSUCERS AND METHOD FOR MANUFACTURING SAME

摘要

An acoustic stack for ultrasonic transducers comprising a backing block, flexible printed circuit board, piezoelectric ceramic layer, and acoustic ma tching layer. The various components of the acoustic stack are bonded togeth er using an adhesive material and high pressure in a lamination process. The piezoelectric ceramic layer is manufactured to provide electrical and acous tic isolation without the need for dicing through multiple layers of the aco ustic stack. A flex circuit provides the necessary electrical connections to the electrically isolated electrodes of the piezoelectric ceramic layer.