发明名称 PHOTOSENSITIVE COMPOSITION, COMPOUND USED FOR THE PHOTOSENSITIVE COMPOSITION AND PATTERN-FORMING METHOD USING THE PHOTOSENSITIVE COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive composition improved in PEB temperature dependency and exposure latitude and a pattern-forming method using the same, with respect to the photosensitive composition for use in the production process of a semiconductor such as IC, in the production of a circuit substrate of a liquid crystal, a thermal head and the like or in other photofabrication processes and a pattern-forming method using the same. <P>SOLUTION: The photosensitive composition comprises: (A) a compound capable of generating a bis(organosulfonyl)imidic acid of a specific structure upon irradiation with actinic ray or radiation; and (B) a resin that decomposes by the action of an acid to increase its solubility in an alkali developer. The pattern-forming method using the same is also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008257198(A) 申请公布日期 2008.10.23
申请号 JP20080026524 申请日期 2008.02.06
申请人 FUJIFILM CORP 发明人 KODAMA KUNIHIKO
分类号 G03F7/004;C07C311/48;C07C381/12;G03F7/039 主分类号 G03F7/004
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