发明名称 |
Preserving Solderability and Inhibiting Whisker Growth in Tin Surfaces of Electronic Components |
摘要 |
A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 m and about 4.0 m in thickness. There is a nickel-based layer under the tin coating.
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申请公布号 |
US2008261071(A1) |
申请公布日期 |
2008.10.23 |
申请号 |
US20080597374 |
申请日期 |
2008.07.10 |
申请人 |
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发明人 |
XU CHEN;ZHANG YUN;FAN CHONGLUN;KHASELEV OSCAR;ABYS JOSEPH A.;WALCH ERIC;KLEINFELD MARLIES;ECKERT HANS ULLRICH |
分类号 |
B32B15/01;C25D5/12;H01L23/495;H01R4/02;H01R13/03;H05K3/34 |
主分类号 |
B32B15/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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