| 摘要 |
A semiconductor device includes: solder balls provided on an upper package; and pads provided on a lower package and directly connected to the solder balls, wherein at least one of the pads serves as a fiducial mark. Further, a shape of at least one of the pads is different from that of other pads and an area of at least one of the pads is substantially equal to that of the other pads.
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