发明名称 HIGH-SPEED, PRECISE LASER-BASED MODIFICATION OF ELECTRICAL ELEMENTS
摘要 A method and system for high-speed, precise, laser-based modification of at least one electrical element made of a target material is provided. The system includes a laser subsystem that generates a pulsed laser output wherein each laser pulse has a pulse energy, a laser wavelength within a range of ablation sensitivity of the target material, and a pulse duration short enough to substantially reduce ablation threshold energy density of the target material. The system further includes a beam positioner that selectively irradiates the at least one electrical element with the one or more laser pulses focused into at least one spot so as to cause the one or more laser pulses to selectively ablate a portion of the target material from the at least one element while avoiding both substantial spurious opto- electric effects and undesirable damage to the non-target material.
申请公布号 WO2008103799(A3) 申请公布日期 2008.10.23
申请号 WO2008US54534 申请日期 2008.02.21
申请人 GSI GROUP CORPORATION;GU, BO;SVETKOFF, DONALD, J. 发明人 GU, BO;SVETKOFF, DONALD, J.
分类号 G01L21/30;B44C1/22 主分类号 G01L21/30
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