| 摘要 |
<p>To accurately mount a number of semiconductor wafers on an accurately dimensioned mounting plate, using a wax adhesive, an unusually high amount of pressure is used to render the wax adhesive films beneath the wafers as thin as possible, and thus of uniform thickness from wafer to wafer. To avoid breakage of the wafers, a slip plate is used between the pressure applying means, which includes a compressible pad, and the wafers, the slip plate allowing lateral expansion of the compressible pad while not imparting lateral stresses to the wafers. The wafers are eventually polished using a polishing pad having a convex surface to provide exceptionally flat wafer surfaces.</p> |
