RESIN FILM FORMING METHOD, RESIN FILM FORMING APPARATUS AND MANUFACTURING METHOD OF ELECTRONIC CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To uniformize the width or film thickness of a resin film pattern without producing bulge or gyagi. SOLUTION: This resin film forming method for forming a resin film or a substrate by discharging liquid droplets of a resin liquid by an ink jet method includes a first resin liquid arranging process for arranging a large number of liquid droplets of a first resin liquid on a substrate in a spaced-apart state so as not to bring them into contact with each other, a first resin liquid curing process for curing at least the surfaces of the liquid droplets of the first resin liquid arranged on the substrate, a second resin liquid arranging process for arranging the liquid droplets of a second resin liquid to the almost central parts between the liquid droplets of the first resin liquid on the substrate after at least the surfaces of the liquid droplets of the first resin liquid are cured and a second resin liquid curing process for curing the liquid droplets of the second resin liquid arranged on the substrate. COPYRIGHT: (C)2009,JPO&INPIT