| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a micro antenna available for an extremely small package in radio wavelength. <P>SOLUTION: This integrated circuit package comprises a substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna disposed within an integrated circuit package and at least not on the one semiconductor die. A conductive pattern comprises a curve including at least five segments and at least three segments are shorter than a 1/10 of longest free space operation wavelength of the antenna. Each of the five segments forms a pair of angles with neighboring segments within the curve. In four pairs of angles between segments, a smaller angle is <180°, at least two angles are <150°, at least two angles are not equal, the curve is settled within a rectangular area, and a longest edge of the area is shorter than 1/5 of longest free space operation wavelength of the antenna. <P>COPYRIGHT: (C)2009,JPO&INPIT |
