| 摘要 |
PROBLEM TO BE SOLVED: To provide a cover for an electronic device having a flat surface and good appearance, and a manufacturing method of a cover for an electronic device with improved manufacturing efficiency. SOLUTION: The cover for an electronic device includes a trim layer and a plastic layer, and the trim layer includes an electronic ink layer and a thin film layer which are integrally formed. This manufacturing method includes a step of providing the trim layer including the electronic ink layer and the thin film layer; a step of providing an injection molding die in which a female die and a male die are included, a concave portion is formed on the female die and a molding portion having a concave portion is formed on the male die; a step of mounting the trim layer on the concave portion of the male die; a step of mating the female die with the male die to form a cavity between the molding concave portion of the female die and the molding portion of the male die; a step of injecting a thermosetting resin material into the cavity to form a plastic layer to be formed integrally with the trim layer; and a step of taking out the cover for an electronic device in which the plastic layer and the trim layer are integrally formed after the plastic layer is cured. COPYRIGHT: (C)2009,JPO&INPIT
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