发明名称 |
A METHOD OF MANUFACTURING THE HIGH HEAT CONDUCTIVE CIRCUIT SUBSTRATE |
摘要 |
A method of manufacturing the high heat conductive circuit substrate (50) includes the following steps: proving a metal substrate (10); forming an insulating layer (20) on the surface of the metal substrate (10), the insulating layer (20) making up the oxide of the metal substrate (10); forming a medium layer (30) on the surface of the insulating layer (20); forming a main conductive layer (40) on the surface of the medium layer (30). |
申请公布号 |
WO2008125010(A1) |
申请公布日期 |
2008.10.23 |
申请号 |
WO2008CN00733 |
申请日期 |
2008.04.10 |
申请人 |
COSMOS VACUUM TECHNOLOGY CORPORATION;HUANG, HSU-TAN;CHOU, CHUNG-LIN |
发明人 |
HUANG, HSU-TAN;CHOU, CHUNG-LIN |
分类号 |
H01L21/48;H01L23/36;H05K1/05;H05K3/44;H05K7/20 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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