发明名称 A METHOD OF MANUFACTURING THE HIGH HEAT CONDUCTIVE CIRCUIT SUBSTRATE
摘要 A method of manufacturing the high heat conductive circuit substrate (50) includes the following steps: proving a metal substrate (10); forming an insulating layer (20) on the surface of the metal substrate (10), the insulating layer (20) making up the oxide of the metal substrate (10); forming a medium layer (30) on the surface of the insulating layer (20); forming a main conductive layer (40) on the surface of the medium layer (30).
申请公布号 WO2008125010(A1) 申请公布日期 2008.10.23
申请号 WO2008CN00733 申请日期 2008.04.10
申请人 COSMOS VACUUM TECHNOLOGY CORPORATION;HUANG, HSU-TAN;CHOU, CHUNG-LIN 发明人 HUANG, HSU-TAN;CHOU, CHUNG-LIN
分类号 H01L21/48;H01L23/36;H05K1/05;H05K3/44;H05K7/20 主分类号 H01L21/48
代理机构 代理人
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