发明名称 Integrated circuits and interconnect structure for integrated circuits
摘要 An integrated circuit includes N plane-like metal layers. A first plane-like metal layer includes M contact portions that communicate with the N plane-like metal layers, respectively. The first source region is arranged between first sides of the first and second drain regions and the second and third source regions are arranged adjacent to second sides of the first and second drain regions. A fourth source region is arranged adjacent to third sides of the first and second drain regions and a fifth source region is arranged adjacent to fourth sides of the first and second drain regions. First and second drain contacts are arranged in the first and second drain regions, respectively. At least two of the first, second, third, fourth and fifth source regions and the first and second drain regions communicate with at least two of the N plane-like metal layers.
申请公布号 US2008258241(A1) 申请公布日期 2008.10.23
申请号 US20080156392 申请日期 2008.05.30
申请人 发明人 SUTARDJA SEHAT
分类号 H01L27/088;H01L21/60;H01L23/48 主分类号 H01L27/088
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