| 摘要 |
A sorting table of a semiconductor package is provided to sort packages without performing an additional process for increasing pitches of the packages. A chamber(20) is formed on a lower surface of a base plate(10). A pumping unit exhausts the base plate or the chamber. A movable plate(30) is moved in a horizontal direction on an upper surface of the base plate. The movable plate includes a plurality of exhaust holes to absorb a package by using the pumping unit. A shielding unit shields selectively the exhaust holes. The shielding unit includes a casing and an opening/shutting part for opening/shutting the exhaust holes. The casing is mounted in the chamber. A first exhaust line is formed in the inside of the casing.
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