FABRIC TYPE SEMICONDUCTOR DEVICE PACKAGE, INSTALLING AND MANUFACTURING METHOD THEREOF

摘要

A fabric-type semiconductor device package is provided to minimize foreign substances by using a fabric-type printed circuit board made of fabric. Fabric and conductive material formed on the fabric are patterned to form a fabric-type printed circuit board(100) including a lead part(110). An electrode part(210) of a semiconductor device(200) is bonded to the lead part of the fabric-type printed circuit board. The fabric-type printed circuit board and the semiconductor device are sealed by a molding part(300). The electrode part of the semiconductor device can be wire-bonded to the lead part of the fabric-type printed circuit board by a wire(220).