发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a stencil printing method which can always and stably carry out printing by preventing occurrence of printing defects such as misregistration, printing blur, oozing or missing irrespective of change and the like of an time interval for printing, and to provide its apparatus. <P>SOLUTION: A process for coating solder paste 32 on an upper surface of the stencil 2 by moving one side squeegee 4 along the upper surface of the stencil 2 while a circuit printed wiring board 1 and the stencil 2 are positioned in a specific relative position to be kept in a mutually opposed positioning state by keeping a specific space between a tip part 4a of one side squeegee 4 and an upper surface of the stencil 2; and a process for filling the solder paste 32 in a pattern opening part 33 of the stencil 2 by moving the other squeegee 7 along the upper surface of the stencil 2 while a printing pressure is added to the other squeegee 7 on the upper surface of the stencil 2, are provided. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP4171663(B2) 申请公布日期 2008.10.22
申请号 JP20030064299 申请日期 2003.03.11
申请人 发明人
分类号 B41F15/40;B41F15/08;B41F15/42;B41F33/14;H05K3/34 主分类号 B41F15/40
代理机构 代理人
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