MANUFACTURING METHOD FOR WELDING PAD APPLICABLE TO EPITAXY OF LIGHT EMITTING DIODE AND STRUCTURE THEREOF

摘要

A method for manufacturing a welding pad applicable to a light emitting diode epoxy and a structure thereof are provided to improve roughness of surfaces of the welding pad by adjusting plating conditions to make a deposition-plated crystal particle fine and to increase a bonding strength between the welding pad and a welding line. A method for manufacturing a welding pad applicable to a light emitting diode epoxy includes the steps of; providing an epoxy on which at least one substrate(20) and a first metal layer(22) are formed; processing improvement of a surface bonding force for a first surface of the first metal; forming a second metal layer on the first surface of the first metal layer in a metal deposition process; and forming one welding pad(25) on a surface of the epoxy in a micro etching process. The processing improvement of a surface bonding force is plasma processing, polishing by fine fiber yarn or textile. The metal deposition method is a deposition plate or a dispersion plate.