发明名称 |
MANUFACTURING METHOD OF THERMOELECTRIC MODULE |
摘要 |
A method for manufacturing a thermocouple module is provided to easily manufacture a thermocouple module of large area and to omit processing and a bonding process of a thermocouple material. A method for manufacturing a thermocouple module includes the steps of: forming an upper electrode and a lower electrode(134) on one surface of an upper substrate(110) defining an upper profile or one surface of a lower substrate(120) defining a lower profile; forming a P-type semiconductor(140) and an N-type semiconductor(150) in paste state on one surface of the upper electrode and the lower electrode; and adhering the upper substrate and the lower substrate to each other to form the thermocouple module. The upper electrode, the lower electrode, the P-type semiconductor, and the N-type semiconductor are formed by a screen printing process.
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申请公布号 |
KR20080093512(A) |
申请公布日期 |
2008.10.22 |
申请号 |
KR20070037287 |
申请日期 |
2007.04.17 |
申请人 |
KOREA INSTITUTE OF MACHINERY & MATERIALS |
发明人 |
HA, GOOK HYUN;YU, JI HUN;LEE, GIL GUN |
分类号 |
H01L35/32;H01L23/34 |
主分类号 |
H01L35/32 |
代理机构 |
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地址 |
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