WAFER LIFT UNIT AND SEMICONDUCTOR MANUFACTURING APPARATUS WITH THE SAME

摘要

A wafer lift unit and a semiconductor manufacturing apparatus including the same are provided to prevent the damage and a breakdown of a wafer caused by vibration of a wafer supporting plate in an elevating process of the wafer supporting plate. A wafer supporting plate is positioned in an inside of a process chamber. The wafer supporting plate is used for supporting a wafer. A through-hole(131) is formed on an upper surface of the wafer supporting plate. A plurality of lift pins(140) are installed in the through-hole of the wafer supporting plate. A screw part(141) is formed at a lower part of the lift pin. A lift ring(150) is positioned at a lower part of the wafer supporting plate and includes a screw hole(151) to be coupled with the screw part of the lift pin. A lift pin separation prevention unit prevents the separation of the lift pin from the lift ring when the screw part of the lift pin is coupled with the screw hole of the lift ring.