METHOD OF MANUFACTURING PRINTED WIRING BOARD

摘要

Problem: To provide a method of manufacturing a printed wiring board whereby bumps that are high in height can with certainty be formed on small-diameter connection pads provided in the openings in a solder resist. Means for Solution: The solder balls are melted by reflow to form solder bumps 78U having a high height out of the solder balls 77 loaded in the openings 71 on the upper face. At that time, the distance between the solder balls 77 loaded into the openings 71 and the connection pads 158P is brought close with the adjustment of the thickness of the solder resist layer 70 such that the connection between the solder bumps 78U and the connection pads 158P can with certainty be obtained upon reflow of the solder balls 77.