<p>Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.</p>
申请公布号
EP1978134(A1)
申请公布日期
2008.10.08
申请号
EP20080251284
申请日期
2008.04.02
申请人
ROHM AND HAAS ELECTRONIC MATERIALS LLC
发明人
REDDINGTON, ERIK;DESMAISON, GONZALO URRUTIA;NIAZIMBETOVA, ZUKHRA I.;CLEARY, DONALD E.;LEFEBVRE, MARK
