FORMING METHOD OF SEMICONDUCTOR UNIT

摘要

A forming method of a semiconductor unit is provided to simplify a manufacturing process by eliminating an assembling process of a chip module and a memory card body. A preparation process is performed to prepare an injection mold(S1). The injection mold includes an upper mold and a lower mold. An insertion process is performed to load selectively a chip module into a cavity of the lower mold and to form a sealing state of an internal space between the lower and upper molds(S2). An implantation process is performed to implant a synthetic resin solution into the cavity(S3). An injection molding process is performed to form a body of a memory card by hardening the synthetic resin solution(S4). An injection molding structure is separated from the injection mold(S5).