CHIP HAVING SIDE PAD, METHOD OF FABRICATION THE SAME AND PACKAGE USING THE CHIP

摘要

A chip having side pads is provided to adjust the height of conductive patterns by including dimples capable of adjusting the height of the conductive patterns separated from a sidewall, remove the necessity of a separate photolithography process by forming the dimples as forming an electric structure in the chip. A package using the chip is provided to reduce the thickness of a single or layered package by directly layering the chip on the package and make the package small by connecting the chips in parallel using the side pads and the dimples. A chip(100) includes side pads(120), which are exposed to a sidewall and are comprised of a plurality of conductive patterns(120a, 120b) separated from one another in a vertical direction, and dimples(170) which are respectively located a upper surface and lower surface of the side pads to adjust the locations of the side pads.