Micro-structured components with a substrate and a chip directly contacting the substrate, and method for its manufacture

摘要

The component has a substrate (1), and a chip (2), which carries several active structures (5) on its surfaces, which face one another. The substrate and chip are connected with one another by a sealing frame in such a manner that the active structures are sufficiently protected on the chip and substrate against undesired environmental influences. The chip carries an electrical contact point (4), which stays in conducting contact with the active structures. The point (4) is connected with an electrical contact point (4'), which is provided on the substrate in an electrically conducting manner. An independent claim is also included for a method for producing the micro structured component.