WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

A wiring board and a method for manufacturing the same are provided to secure a sufficient bonding property to a resin layer by forming a wiring layer on the resin layer with a nickel-copper alloy within a predetermined composition range. A method for manufacturing a wiring board includes the steps of: forming a nickel-copper alloy bonding seed layer(20) on an entire surface of a region on a resin insulating layer(10) at which a wiring layer is to be formed; forming a plated resist pattern(16) on the bonding seed layer; forming a copper wiring layer(19) in an opening of the plated resist pattern through electrolytic plating by using the bonding seed layer as a feeding layer; removing the plated resist pattern; and removing the bonding seed layer of a portion exposed by removing the plated resist pattern.