SUBSTRATES FOR ELECTRONIC CIRCUITRY TYPE APPLICATIONS
摘要
<p>An electronic type substrate having 40 to 97 weight-percent polymer and 3 to 60 weight-percent auto-catalytic crystalline filler. An interconnect or a conductor trace is created in the substrate by: i. drilling or ablating with a high energy electromagnetic source, such as a laser, thereby selectively activating the multi cation crystal filler along the surface created by the drilling or ablating step; and ii. metalizing by electroless and/or electrolytic plating into the drilled or ablated portion of the substrate, where the metal layer is formed in a contacting relationship with the activated multi cation crystal filler at the interconnect boundary without a need for a separate metallization seed layer or pre-dip.</p>
申请公布号
EP1977633(A2)
申请公布日期
2008.10.08
申请号
EP20060848261
申请日期
2006.12.28
申请人
E.I. DU PONT DE NEMOURS AND COMPANY
发明人
LEE, YUEH-LING;DUNBAR, MEREDITH, L.;FANG, XIN, SHANE;WANG, CARL