| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for light emitting element accommodation and a light emitting device which assure higher radiation intensity and excellent optical characteristics such as luminance and color rendering property or the like. <P>SOLUTION: The package for light emitting element accommodation is provided with a base material 1 including the mounting part 1a of a light emitting element 5 at the center of the upper surface, a light reflecting member frame 2 provided surrounding the mounting part 1a at the external circumference of the upper surface of the base material 1, and a conductive layer 7 formed on the mounting part 1a for electrical connection of the light emitting element 5 via a conductive bonding material 8. The conductive layer 7 allows formation of a projected area formed, in the circumference, of an insulating material which becomes large in the width as it goes to the lower side. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
