| 摘要 |
A power semiconductor module for implementing pressure contact and a method for manufacturing the same are provided to reduce a manufacturing cost and assembling time by exactly and conveniently performing an assembling, and to considerably improve heat-dispersion efficiency to a heat-absorption part. A power semiconductor module for implementing pressure contact includes at least one substrate(12), a mounting body(22), a cover(48) and at least one pad element(42). The at least one substrate has a conductor track(18) and a power semiconductor component(20) on an upper surface spaced apart from a cooling component. The mounting body forms pressure contact with the conductor track. A rod connector(38) is disposed in the mounting body. The cover is engaged with the mounting body to cover respective surfaces of the mounting body. The cover fixes the power semiconductor module to the cooling component through a fixing hole. The at least one pad element is provided on the substrate and is bound between the cover and a strip portion of the rod connector.
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