| 摘要 |
To provide a low-cost, efficient semiconductor device manufacturing method for connecting electrodes of a pair of bases (e.g., a pair of a semiconductor chip and a circuit board, or a pair of semiconductor chips) together in a short time. The method of the present invention includes: forming magnetic bumps 34 on at least one of first and second bases 10 A and 40 to be bonded together at their corresponding electrodes (e.g., electrodes 15 and electrodes 41 ); aligning the electrodes 15 of the first base 10 A to positions corresponding to the electrodes 41 of the second base 40 for connection, by means of magnetic forces of the magnetic bumps 34 formed over the first base 10 A; and connecting the electrodes 15 of the first base 10 A to the electrodes 41 of the second base 40 , wherein the alignment is made for a plurality of the first bases 10 A at a time.
|
