发明名称 Method and apparatus for dispensing a rinse solution on a substrate
摘要 An apparatus and method for dispensing a rinse solution on a substrate in which the rinse solution is dispensed through one nozzle array substantially near a center of a substrate and is dispensed through a second nozzle array across a radial span of the substrate. Accordingly, the apparatus includes a first nozzle array including at least one nozzle and configured to dispense the rinse solution substantially near a center of the substrate, a first control valve coupled to the first nozzle array and configured to actuate a first flow rate of the rinse solution through the first nozzle array, a second nozzle array including a plurality of nozzles and configured to dispense the rinse solution across a radial span of the substrate, and a second control valve coupled to the second nozzle array and configured to actuate a second flow rate of said rinse solution through the second nozzle array.
申请公布号 US7431040(B2) 申请公布日期 2008.10.07
申请号 US20030673254 申请日期 2003.09.30
申请人 TOKYO ELECTRON LIMITED 发明人 KOSUGI HITOSHI
分类号 H01L21/304;B08B3/02 主分类号 H01L21/304
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